LGA1700 AND LGA1851 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, thanks to even CPU contact surface
NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors - 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard
LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available in the technical data, in the manual and on the manufacturer's website. Please use the compatibility check
